Capabilities

Some of TGMC's Contract Electronic Manufacturing Capabilities are listed below:

Surface Mount Assembly

The surface mount line at TGMC is fully conveyored

Speedprint Screen Printer

SP710 model with onboard paste inspection
Board size range: X-axis 50mm to 450mm
Y-axis 50mm to 400mm
Utilises metal foil stencil to fit 600mm square frame

2 Siemens Si-Place F4

Dual pick and place heads
Placement rate capacity of 7,000 cph
Range of component sizes from
0402 minimum to 50mm x 50mm maximum
BGA and µBGA placement
Variable width component feeders
Waffle tray and stick feeders

Siemens Si-Place S20

Dual gantry two headed system
Placement rate capacity of 20,000 cph
Range of component sizes from
0402 minimum to 18mm x 18mm maximum
BGA and µBGA placement
Variable width component feeders

TSM A70-j82S

8-zone convection reflow oven

Conventional Through Hole Assembly

Blundell CMS 400LF

Fully programmable Wave Solder Machine
Two tanks containing a low sac alloy lead free solder
Maximum board width 400mm  

Bench Equipment

Manual Work Stations
Ersa, lead free, digital soldering irons
Filtronic MG100S bench fume extraction

Inspection and Rework

Ersa IR550A BGA Rework Station
Ersascope BGA Inspection System
AOI Systems
Mantis Inspection Systems with changeable X2 to x10 magnification

Test Equipment

Customer furnished STTE
Tek 2465B 400MHz Oscilloscope
Gould 900 200MHz Oscilloscope
Various DVM's and Power Supplies

Working Standards

IPC-A-610 Class 2 as standard
ISO9001:2015 approved

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Capabilities
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Prototyping
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Design
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Quality Policy